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Daeduck Electronics: Q2 revenue KRW 401.0bn and operating profit KRW 70.3bn, up…

2026-08-08 · 04:02 UTC ·@jukan05 ·1 min read

Brief

Korean PCB/substrate makers reported strong Q2 results and are expected to push earnings higher in Q3. Daeduck, Simmtech, and TLB posted large YoY gains, leveraging strengths in FC-BGA/FC-CSP, package/memory PCBs, and DDR5/SSD boards. Unimicron's shift to ABF may reallocate BT orders to Daeduck/Simmtech, while NVIDIA's Vera Rubin ramps SOCAMM demand benefiting Simmtech and TLB.

Why it matters

Daeduck Electronics: Q2 revenue KRW 401.0bn and operating profit KRW 70.3bn, up 63% and 3,599% YoY respectively; Simmtech: Q2 revenue KRW 514.6bn and operating profit KRW 62.9bn, up 51% and 1,035% YoY; TLB: Q2 revenue KRW 88.2bn and operating profit KRW 12.8bn, up 38% and 86% YoY.

Key details

  • Product strengths supporting continued momentum: Daeduck focuses on semiconductor package substrates (FC-BGA / FC-CSP) and multilayer PCBs for AI data centers; Simmtech on package substrates and memory-module PCBs; TLB on server DDR5 and enterprise SSD PCBs.
  • Market dynamics: Taiwan's Unimicron is prioritizing high-value ABF substrates and reducing BT exposure, likely redirecting some BT orders to Daeduck and Simmtech; NVIDIA's upcoming Vera Rubin GPU/CPU is lifting SOCAMM PCB demand, strengthening Simmtech and TLB earnings outlooks.
Source evidence

According to Korean press reports, Korean PCB/substrate makers are expected to carry their strong Q2 results into further earnings improvement in Q3.

For example, Daeduck Electronics posted revenue of KRW 401.0bn and operating profit of KRW 70.3bn, up 63% and 3,599% YoY respectively. Simmtech reported revenue of KRW 514.6bn and operating profit of KRW 62.9bn, up 51% and 1,035%. TLB also grew, recording revenue of KRW 88.2bn and operating profit of KRW 12.8bn, up 38% and 86% respectively.

Daeduck Electronics' strengths lie in semiconductor package substrates (FC-BGA / FC-CSP) and multilayer printed circuit boards (MLB) for AI data centers; Simmtech's in package substrates and memory module PCBs; and TLB's in PCBs for server DDR5 and enterprise solid-state drives (SSDs).

Notably, as major players including Taiwan's Unimicron prioritize capacity allocation toward high-value ABF substrates and scale back their BT substrate exposure, there is growing speculation that some of that order flow could shift to Daeduck Electronics and Simmtech, which produce BT substrates for memory and system semiconductors.

SOCAMM is emerging as another growth driver. With NVIDIA's next-generation AI platform — the Vera Rubin GPU and Vera CPU — approaching shipment, the demand outlook for SOCAMM PCBs is strengthening, lifting earnings expectations for Simmtech and TLB, both of which supply related products.