Reader · no content
No body text on file.
Open the original to read the full piece.
The DCD Telecoms & Connectivity Channel stream on 13 April 2026 examined connectivity strategies for high‑density AI infrastructure, covering multicore fiber (Corning) to boost capacity in existing pathways, remote deployment engineering (Telstra, Cambridge Consultants), multifiber test methods (VIAVI) to shorten commissioning, and structured rack‑scale fiber (CommScope) to standardize high-density GPU deployments.
Open the original to read the full piece.